DARPA Seeks Input on Architectural Strategy for Chiplet-Based Microsystems Devt; Daniel Green Comments

The Defense Advanced Research Projects Agency has asked industry to provide information on an architectural framework designed to facilitate the design and development of microsystems through the use of miniaturized chips or “chiplets.”

The Common Heterogeneous Integration and Intellectual Property Reuse Strategies program “is all about devising a physical library of component chips, or chiplets, that we can assemble in a modular fashion,” Daniel Green, manager of the CHIPS program, said in a statement released Tuesday.

DARPA said it plans to use that library of chiplets to assemble and integrate the miniaturized, single-function chips onto an electrical interface or interposer to perform various functions, such as signal processing, data storage and data flow management.

The agency also plans to conduct a workshop by late summer of 2016 to develop a broad agency announcement for the program.

DARPA said in a FedBizOpps notice published Monday the request for information seeks insights on how to leverage interface standards and IP blocks to build customized circuits as well as reduce the time and cost of the technology development process.

Responses to the RFI are due July 29, according to the notice.