General Electric’s intelligent platforms business has obtained license to use Northrop Grumman’s air-flow-through cooling technology for military electronic module application.
The air-flow-through cooling system incorporates a novel heat exchanger to protect electronic modules and isolates electronic parts from the cooling air using a central channel with heat fins, Northrop said Thursday.
Tom Jones, vice president and general manager of advanced concepts and technologies at Northrop Grumman’s electronic systems, said the cooling technology paves the way for developing rugged electronic systems across the military and commercial electronics fields.
“This improvement is a key method of cooling electronic modules that can serve a wide variety of applications,†added Jones.
Northrop integrated its patented sliding air seals into the inlet and outlet of the modules to aid in the flow of cooling air.
The cooling technology is capable of 175 watts of cooling per module and complies with the electronic industry’s VMEbus International Trade Association 48.5 standard, the companies said.