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IBM to Design Self-Destructing Microchips For DARPA

IBM to Design Self-Destructing Microchips For DARPA - top government contractors - best government contracting event
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IBMlogo3 EbizIBM will develop microchip technology that is designed to use a self-destruct mechanism under a $3.5 million contract awarded by the Defense Advanced Research Projects Agency.

The company will explore methods for remotely shattering CMOS-based military electronics into powder once the items are discarded, DARPA said Friday in a FedBizOpps notice.

DARPA says IBM intends to use strained glass substrates, an external radio frequency signal and reactive fuse elements to initiate the transient process.

The agency awarded the contract to the company under its Vanishing Programmable Resources program.

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Written by Mary-Louise Hoffman

is a writer of news summaries about executive-level business activity in the government contracting sector. Her reports for ExecutiveBiz are focused on trends and events that drive the GovCon industry to include commercial technologies that private companies are developing for federal government use. She contributes news content to ExecutiveBiz’s sister sites GovCon Wire and ExecutiveGov.

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